LuGuang Electronic applies for a patent for semiconductor chip packaging structure and method
According to the information of the China National Intellectual Property Administration, Shenzhen Luguang Electronic Technology Co., Ltd. applied for a patent entitled "Semiconductor Chip Packaging Structure and Packaging Method", with the publication number of CN 118943084A and the application date of October 2024.
The patent abstract shows that the present invention discloses a semiconductor chip packaging structure and packaging method, which relates to the field of semiconductor chip packaging technology. A semiconductor chip packaging structure comprises: a chip and a substrate. The substrate comprises a chip mounting area, and the chip is set in the chip mounting area; Non installation area; A cavity, comprising a first cavity and a second cavity, wherein the first cavity is disposed between the chip mounting area and the non mounting area to partition or partially partition the chip mounting area and the non mounting area, and the second cavity is disposed between the bottom of the chip mounting area and the bottom surface of the substrate; The buffer portion is filled in the first cavity and the second cavity. The dual cavity design of the first and second cavities effectively reduces the mechanical stress transmission of the chip at the bottom and sides of the chip installation area, especially under vibration and impact, reducing the risk of damage to fragile parts of the connecting devices and ensuring the mechanical stability of the components.
