Nuremberg Electronics and Power Exhibition, Germany
Exhibition Information
Exhibition Name: Nuremberg Electronics and Power Exhibition, Germany
Exhibition period: May 5th to May 9th, 2019
Exhibition location: Nuremberg Exhibition Center, Germany
Booth number: HALL6-262#
Exhibition Introduction
The Nuremberg Power Electronics Systems and Components Exhibition will be held from May 7th to May 9th, 2019 at the Nuremberg International Exhibition Center in Germany. The exhibition was founded in 1979 and is held annually, with a history of over 30 years. The full name of PCIM Europe Exhibition is "PCIM Europe International Exhibition and Seminar on Power Electronics, Intelligent Sports, Renewable Energy and Energy Management". This exhibition is the most influential exhibition in the field of power electronics and its applications, intelligent sports, and power quality in Europe, as well as the world's largest power semiconductor exhibition.
Exhibition scope
Semiconductors: power semiconductors, bipolar transistors, Darlington transistors, diodes, semiconductor relays, insulated gate bipolar transistors, power modules and hybrid power, metal oxide semiconductor field-effect transistors, fast recovery rectifiers, silicon carbide, intelligent power integrated circuits (motor drivers), thyristors, integrated circuits and optoelectronic components, linear integrated circuits, specialized integrated circuits, digital integrated circuits, mixed signal integrated circuits, intelligent power integrated circuit motor drivers, optoelectronic semiconductor components, power factor correction integrated circuits, voltage stabilizing control integrated circuits, converter integrated circuits,
Passive components: capacitors, supercapacitors, thermistors, varistors, resistors
Magnetic and core materials: ferroelectric ceramic products, hard ferrite products, magnetic cores, magnetic core materials, magnetic core components, permanent magnet products, plastic bonded magnets, inductors, coils, transformers, soft ferrite products
Heat dissipation management: heat sink, fan, Peltier element, thermal shielding, thermal insulation, thermal composite, thermal switch, thermocouple, chip module assembly substrate, heat pipe heat exchanger, water cooling system
Information and services: training, consulting services, technical books: sports, technical books: power electronics, technical books: power quality, document services, technical publications